Semiconductor assembly equipment Wire Bonder FB-900
Further evolved, speed and stability.
This is an introduction to semiconductor assembly equipment capable of supporting small-lot production of various types.
- Company:カイジョー ODM事業部
- Price:Other
1~3 item / All 3 items
Further evolved, speed and stability.
This is an introduction to semiconductor assembly equipment capable of supporting small-lot production of various types.
Realizing joining technology for new fields
Operator-friendly, stable, full-auto wire bonder.
Capable of supporting small-lot production of multiple varieties, contributing to increased productivity.
Fine pitch, stacked IC Fully automatic wire bonder compatible with all cutting-edge devices.